Hotchips2019会议论文下载

晶度

Sunday, 8/18/2019: Tutorials
8:00 AM – 9:15 AM: Registration / Breakfast
9:15 AM – 12:45 AM: Morning Tutorials: Acceleration in the Cloud
9:15 AM – 10:15 AM: The Nitro Project – Next Generation AWS Infrastructure
10:15 AM – 11:15 AM: Acceleration at Microsoft
11:15 AM – 11:45 AM: Break
11:45 AM – 12:45 PM: TPU V3 in Google Cloud: Architecture and Infrastructure
12:45 PM – 2:00 PM: Lunch
2:00 PM – 5:00 PM: Afternoon Tutorial: RISC-V
5:00 PM – 6:00 PM: Reception
Monday, 8/19/2019: Conference Day 1
7:30 AM – 8:45 AM: Registration / Breakfast (sponsored by Intel)
8:45 AM – 9:00 AM: Opening Remarks
9:00 AM – 10:30 AM: General Purpose Compute
10:30 AM – 11:00 AM: Break (sponsored by Intel)
11:00 AM – 12:30 PM: Memory
12:30 PM – 1:45 PM: Lunch (sponsored by Intel)
1:45 PM – 2:45 PM: Keynote 1: “Delivering the Future of High-Performance Computing with System, Software and Silicon Co-Optimization” by Dr. Lisa Su, CEO, AMD
2:45 PM – 4:15 PM: Methodology and ML Systems
4:15 PM – 4:45 PM: Break (sponsored by Intel)
4:45 PM – 6:45 PM: ML Training
6:45 PM – 7:45 PM: Reception (Wine & Snacks sponsored by Intel)
Tuesday, 8/20/2019: Conference Day 2
8:00 AM – 9:00 AM: Registration / Breakfast (sponsored by Intel)
9:00 AM – 10:30 AM: Embedded and Auto
10:30 AM – 11:00 AM: Break (sponsored by Intel)
11:00 AM – 12:30 PM: ML Inference
12:30 PM – 1:45 PM: Lunch (sponsored by Intel)
1:45 PM – 2:45 PM: Keynote 2: “What Will the Next Node Offer Us?” by Dr. Philip Wong, VP Corporate Research, TSMC
2:45 PM – 3:45 PM: Interconnects
3:45 PM – 4:15 PM: Break (sponsored by Intel)
4:15 PM – 5:15 PM: Packaging and Security
5:15 PM – 6:45 PM: Graphics and AR
6:45 PM – 7:00 PM: Closing Remarks