Testing of Interposer-Based 2.5D Integrated Circuits

胡露

Testing of Interposer-Based 2.5D Integrated Circuits  －－－ 基于插入式2.5D集成电路的测试

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

本书为读者提供了2.5D集成电路设计，测试和优化方面的深入指导。 本书的作者描述了一套用于测试的设计方法，以解决新一代2.5D IC所带来的各种挑战，包括硅中介层的预结合测试，高速互连测试，内置自测体系结构， 以及用于SoC芯片中的低功率扫描偏移的可编程方法。 本书涵盖了许多已经在主流半导体公司使用的测试技术。 读者将从深入了解测试技术解决方案中受益，这些解决方案是使2.5D IC成为现实和商业上可行的必要条件。

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