层数：4层
用途：转接板
BOM：
<Comment | Designator | Quantity | Footprint | CPCI_56 | AD_P0 | 1 | P0X8 | CPC_112 | AD_P1 | 1 | M_9X16 | CPC_112 | AD_P2 | 1 | P2X16 | 1uF | C1 | 1 | 0603 | CAP | Cpow4_D | 1 | 2220 | Comment | Designator1 | 1 | 2220 | DIODE SCHOTTKY | Dpow1_D | 1 | 2220 | CON3 | J1, J2, J232_1, J232_2, J485 | 5 | SIP3 | CON5 | J422 | 1 | SIP5 | HEADER 20X2 | JP1, JP2 | 2 | IDC40 | HEADER 5X2 | JTAG | 1 | IDC10 | DB9 | J_232 | 1 | DB9/F | INDUCTOR IRON | Lpow_D | 1 | 2220 | PCIe | pcie | 1 | X4_P | LM2XXX | P_D | 1 | LM2596 | 4.7K | R1, R2, R6 | 3 | 0603 | 2K | R3 | 1 | 0603 | 4.7K | R4 | 1 | 0805 | 10K | R5, R7 | 2 | 0603 | RES2 | R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, R28, R29 | 22 | 0805 | Comment | RGND1 | 1 | 0805 | 0 | RGND2 | 1 | 0805 | SW DIP-8 | S1 | 1 | DIP16 | 10K | sR2_2, sR3_2, sR4_2, sR5_2 | 4 | 0805
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发表于 2017-12-11 11:24:06
