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[Cadence Allegro] 飞思卡尔TWR-VF65GS10开发板(K4B1G1646G+MC74HC125ADTG+IT7803M+BD3539FV...

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发表于 2017-3-26 22:06:47 | 显示全部楼层 |阅读模式
飞思卡尔TWR-VF65GS10开发板(K4B1G1646G+MC74HC125ADTG+IT7803M+BD3539FVM)PCB文件
层数:8层
用途:开发板
作品截图:

112751rjqyo1ckacoxw4wa.jpg
112751wqnz7barn0tpe777.png

产品特性:

  • Vybrid VF61NS151CMK50处理器(500 MHz的双核ARM Cortex-A5+167 MHz的ARM Cortex-M4、1.0 MB的SRAM、512 KB的L2缓存、双以太网、双USB、高级安全性)
  • 基于K20DX128VFM5的Kinetis OpenSDA电路
  • 1 Gb x 16 (128 MB) DDR3采用96 FBGA封装(三星公司)
  • 2 Gb x 16 (256 MB) NAND闪存(美光公司)
  • 两个128 Mb (16 MB) 四通道I/O串行闪存(飞索公司)
  • 两个带片上PHY的USB
  • 连接至TWR-LCD-RGB板的接口
  • 4个由用户控制的状态LED
  • 两个机械按钮,一个用于用户输入,另一个用于复位
  • 电位计和MMA8451Q 3轴数字加速度传感器
  • 微型SD卡插槽
  • 面向实时时钟和防篡改检测模块的独立地电池供电电源
附件:

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BOM:

SYM_NAMECOMP_DEVICE_TYPECOMP_VALUECOMP_CLASS
BGA364_0P8_17X17PF701M512ZVLH17_BGA364_0P8_17X1PVF65GS10CMK40IC
CC0805_OVCAP_NP_CC0805_OV_DISCRETE_1.45M10UFDISCRETE
CC1210CAP_NP_CC1210_DISCRETE_2.42 MM_47uFDISCRETE
CN2X82_FINGER_ASSCONN_PCI_XPRESS_X16_328P_CN2X82PCI EXPRESS TOWER SYSTEMIO
CON_FTSH_19M_50_SMCONN_HDR_19_CON_FTSH_19M_50_SM_HDR_19PIO
CON_MIC38PCON_GENERIC_43P_CON_MIC38P_IO_65767054-1IO
CON_MICROUSBB_9F_0P65_SM_RAMICRO_USB_CONN_9PIN_CON_MICROUS1050170001IO
CON_SDCARD_8F_SM_RACONN_MICRO_SD_CARD_REVERSED_CONConn MicroSDIO
CON_TFM_20M_50_SMCONN_SHRHDR_10X2_CON_TFM_20M_50CON_2X10IO
DIO_4MM_4P5X2P9DIODE_SCHTKY_DIO_4MM_4P5X2P9_ICMBRA210IC
DPAK_CASE_369C-01NPN_134_DPAK_CASE_369C-01_IC_2.NJD2873T4IC
DPAK_CASE_369C-01NCP1117_DPAK_DPAK_CASE_369C-01_NCP1117DT33GIC
DPAK_CASE_369C-01NCP1117_DPAK_DPAK_CASE_369C-0_1NCP1117DT15GIC
FBGA96_0P8_7P6X13P41G_DDR3_SDRAM_64MX16_SAMSUNG_FBK4B1G1646G-BCF8IC
HALF-PITCH6SW_DIP-6_HALF-PITCH6_IC_1.50MM_SW_DIP-6_SMIC
HDR102CONN_HDR_2X1_HDR102_IO_8.71 MM_HDR 1X2 THIO
HDR103CONN_HDR_3X1_HDR103_IO_8.65MM_2HDR TH 1X3IO
HDR205_10M_50_SMCONN_HDR_5X2_HDR205_10M_50_SM_IFTSH-105-01-L-DVIO
IND2_4P3X4P3INDUCTOR_FERRITE_A_IND2_4P3X4P32.2uHDISCRETE
IND_0805BEAD_IND_0805_DISCRETE_1.05 MM_330 OHMDISCRETE
JUMP1X4-6040HDR-1X4_JUMP1X4-6040_IO_8.4MM_2HDR_1X4IO
LED_0603LED_LED_0603_IC_0.8MM_370-75080ORANGEIC
MSO8_MO-187BD3539FVM_MSO8_MO-187_IC_0.9MM_BD3539FVMIC
POT3_3352TPOT_POT3_3352T_DISCRETE_470-8015KDISCRETE
QFN32_S142EPPK20DX128V_QFN_32P_QFN32_S142EPPK20DX128VFM5IC
QFN5X3_0P5_3X3MMA8451Q_16P_A_QFN5X3_0P5_3X3_IMMA8451QIC
QSOP16PI3B3257_QSOP_16P_QSOP16_IC_1.7PI3B3257QEIC
RNET_4_8RESISTOR_ARRAY_RNET_4_8_DISCRET47DISCRETE
SKT_BAT_780X1210BATTERY_SKT_3V_SKT_BAT_780X1210BK-883IC
SLP1616P6RCLAMP1654P_SLP1616P6_IC_0.65MMRCLAMP1654P.TCTIC
SO8MIC2526_8P_SO8_IC_1.73MM_312-75MIC2026-1YMIC
SO8_1P27_4X5_TABIT7803M_SO8_1P27_4X5_TAB_IC_1.7IT7803MIC
SOT23NPN_SOT23_IC_1.12 MM_480-75173_MMBT3904LT1GIC
SW4_4MMSW_TACT-SPST-2_SM_SW4_4MM_IC_4.PB switchIC
TDFN12_0P5_3X3P5PI3USB10ZEE_TDFN12_0P5_3X3P5_ICPI3USB10IC
TEST_LOOPTESTLOOP_TEST_LOOP_IC_4.8 MM_21TEST POINT WHITEIC
TEST_LOOPTESTLOOP_TEST_LOOP_IO_4.8 MM_21TEST POINT WHITEIO
TEST_LOOPTESTLOOP_TEST_LOOP_IC_4.8MM_210TEST POINT BLACKIC
TSOP48_18P5X12P4MT29F2G16AADWP_TSOP48_18P5X12P4MT29F2G16ABAEAWP:EIC
TSSOP1474-125_14P_TSSOP14_IC_1.2MM_312MC74HC125ADTGIC
TSSOP2074LCX541_TSSOP20_IC_1.2MM_312-374LCX541IC
USB_A_TH_SAMTECUSB_A_USB_A_TH_SAMTEC_IO_6.95 MUSB_TYPE_A_FEMALEIO
WSON8_1P27_8X6MMS25FL128S_SO_8_WSON8_1P27_8X6MMS25FL128SIC
XTAL3_3P35X1P45_SMXTAL_CS_XTAL3_3P35X1P45_SM_IC_08.00MHZIC
XTAL4_3P3X2P6_SM_FLCRYSTAL_JXS63_XTAL4_3P3X2P6_SM_24MHZIC
XTL2_ECS_SMXTAL_XTL2_ECS_SM_IC_2.25MM_230-32.768KHzIC

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